ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,665, issued on Nov. 3, was assigned to Wisconsin Alumni Research Foundation (Madison, Wis.). "Surface-water-assisted deposition of patterned... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,666, issued on Nov. 3, was assigned to Kokusai Electric Corp. (Tokyo). "Processing method, method of manufacturing semiconductor device, pro... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,668, issued on Nov. 3, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China). "Method of glass deposition for semiconductor... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,669, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods of forming silicon nitride films" was invented... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,670, issued on Nov. 3, was assigned to SK keyfoundry Inc. (Cheongju-si, South Korea). "Method for manufacturing semiconductor die" was inven... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,671, issued on Nov. 3, was assigned to Tokyo Electron Ltd. (Tokyo) and International Business Machines Corp. (Armonk, N.Y.). "Halogen gas mi... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,672, issued on Nov. 3, was assigned to CANSEMI TECHNOLOGY INC. (Guangdong, China). "Method of manufacturing metal interconnection line based... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,673, issued on Nov. 3, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Method of forming semiconductor device and substrate proce... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,674, issued on Nov. 3, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Method of making high aspect ratio openings using mult... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,675, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Comapny Ltd. (Hsinchu, Taiwan). "Semiconductor device and manufact... Read More